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Laser Marking Machine
High Precision Machining Accept Customization Marking Scope UV Marking Machine
| US$2,000.00 - 6,000.00 | 1 set (MOQ) |
Port:
Shanghai, China
Production Capacity:
300
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram
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Product Description
Company Info
Basic Info.
Model NO.
UV laser marking machine
After-sales Service
Online Service
Warranty
One Year
Laser Visibility
Visible/Invisible
Applicable Material
Cooling System
Technical Class
Continuous Wave Laser
Laser Wavelength
Laser Classification
Type
Scanner Marking
Marking Method
Scanning Marking
Trademark
3K laser
Transport Package
Fumigation Wooden Box
Origin
China
HS Code
8515801001
Product Description
This machine uses a semiconductor end-pumped laser to generate 355nm ultraviolet laser after triple frequency.It boasts high conversion rate between laser and electricity. High stability and it adopts galvo marking head with super precision .Output
wavelength is 355nm.It boasts small heat affection.
wavelength is 355nm.It boasts small heat affection.
High efficiency and good marking effect,small volume, and the transportation is convenient;
High electro-optic conversion efficiency, narrow laser pulse width, high peak power.
Small heat affected area,suitable for high-precision machining of scribing and various complex pattern marking fast,good stability.
Widely used in marking on packing materials of food,medicines,cosmetics and wire,drilling tiny hole (hole diameter D≤10μm)Flexible PCB,LCD,TFT marking and slicing.Metallic and non metallic materials thin film removal.Silicon wafer tiny hole and dead hole processing.
It is suitable for the surface marking of glass, polymer materials, etc., micro-hole processing.
High electro-optic conversion efficiency, narrow laser pulse width, high peak power.
Small heat affected area,suitable for high-precision machining of scribing and various complex pattern marking fast,good stability.
Widely used in marking on packing materials of food,medicines,cosmetics and wire,drilling tiny hole (hole diameter D≤10μm)Flexible PCB,LCD,TFT marking and slicing.Metallic and non metallic materials thin film removal.Silicon wafer tiny hole and dead hole processing.
It is suitable for the surface marking of glass, polymer materials, etc., micro-hole processing.
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